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Soldering Gel Flux AG TermoPasty No Clean Flux (1.4ml)
TermoPasty AG No Clean Gel Flux for soldering is a meticulously engineered product of the RMA class, designed specifically for the precise demands of SMT (Surface Mount Technology) assembly and repair tasks. This gel flux is a concentrated rosin-based flux that ensures high-quality soldering with excellent reliability and performance.
Features
- Appearance: Paste
- Color: Amber
- Density: Approx. 1.0 g/cm³ at 20°C
- Non-Volatile Content: >150%
- Solubility: Insoluble in water
- Application: Optimized for SMT repair and assembly, offering superior solderability on various surfaces including Ag, Cu, Au, Zn, Cd, and SnPb alloys.
Packaging
- Conveniently packaged in a 1.4ml syringe for precise application, ensuring minimal waste and clean, accurate flux placement.
- The syringe application allows for direct application through screen stencils or targeted dispensing for specific repair work.
Storage
- Store the gel flux in a cool, dry, and well-ventilated area to maintain its consistency and performance.
- Keep containers tightly sealed when not in use to prolong the shelf life and prevent any contamination.
The AG TermoPasty No Clean Gel Flux is formulated with activators that enable the residues to remain on the package post-soldering, provided the process excludes washing phases. This feature makes it an efficient and time-saving solution for high-paced electronics manufacturing and repair environments.
Advantages
- Saves time with no need for post-soldering cleaning.
- Ensures durable and reliable soldering connections.
- The gel form provides precision without the mess, ideal for detailed SMT work.
TermoPasty AG's commitment to quality and efficiency shines through with this No Clean Gel Flux, making it an essential item in your electronics toolkit for soldering that is both effective and economical.
